達(dá)拉斯（2007年7月23日）消息，愛立信（納斯達(dá)克股票交易號：ERIC）世界領(lǐng)先電信提供商，德州儀器（TI）（紐約證券所交易號：TXN）全球無線通信領(lǐng)導(dǎo)者，于當(dāng)日宣布兩家公司將形成戰(zhàn)略技術(shù)聯(lián)盟為新Open OS開發(fā)用戶解決方案支持3G設(shè)備。 由兩家共同創(chuàng)造的解決方案將會把取自愛立信手機(jī)平臺的小而功能強(qiáng)大的3G調(diào)制解調(diào)器和取得TI的高性能的OMAPTM應(yīng)用處理器相結(jié)合。此聯(lián)盟解決方案將包括：OMAP，自定義基帶和連接性技術(shù)，將支持主要的Open OS，提供應(yīng)用和服務(wù)軟件的簡易訪問。這次聯(lián)合的結(jié)果將使所有的設(shè)備制造商提供先進(jìn)的Open OS手機(jī)，適應(yīng)高端的發(fā)展迅速的中型市場。 TI與愛立信之間的協(xié)作將使手機(jī)制造商提供令人異想不到的手機(jī)娛樂和多媒體體驗(yàn)，滿足世界用戶日益增長的需要。愛立信的訪問技術(shù)，現(xiàn)行的HSPA平臺，具有未來的HSPA解決方案和LTE技術(shù)結(jié)合TI的OMAP 2, OMAP 3尖端技術(shù)的多媒體性能和OMAP下一代處理器將繼續(xù)推動手機(jī)設(shè)備的發(fā)展，明確手機(jī)設(shè)備和手機(jī)娛樂的界線。 結(jié)合TI的OMAP平臺與Open OS支持的Windows®手機(jī)，Symbian S60，Symbian UIQ 和Linux®這些解決方案將為OEMs和操作者提供耐用且靈活的架構(gòu)，用于應(yīng)用和服務(wù)配置。使內(nèi)容和服務(wù)的管理和傳輸更加快捷。這點(diǎn)也使得手機(jī)制造商和手機(jī)運(yùn)營商開始從容易使用，用戶定制化界面，耐用和靈活性應(yīng)用架構(gòu)來區(qū)別手機(jī)。 這次聯(lián)合的結(jié)果將給市場帶來一次具備Open OS支持的無線技術(shù)進(jìn)化組合，減少了復(fù)雜性和投資，縮短了設(shè)備生產(chǎn)商將產(chǎn)品投向市場的時間。該解決方案將調(diào)制解調(diào)器和應(yīng)用處理器進(jìn)行了無縫的集成。 合作解決方案還將使愛立信移動平臺IOT程序受益，工業(yè)上最廣泛的互用性測試處理器，保證了操作者設(shè)備，速度與市場的一至性，并保證了大量產(chǎn)品的生產(chǎn)。 德州儀器無線終端業(yè)務(wù)部副總裁Greg Delagi說：“這是TI與EMP之間長期合作的前奏，我們能夠結(jié)合每一家公司的獨(dú)特的無線技術(shù)為市場傳輸最準(zhǔn)時的，最有目的的解決方案?！盩I的寬闊的，被證明的產(chǎn)品組合和先進(jìn)的制造能力還將繼續(xù)滿足EMP用戶的要求。我們相信，今天的宣布將建立在TI能給EMP帶來什么和兩家公司能給這一關(guān)鍵的行業(yè)帶來什么的目的性之上的。 立信手機(jī)平臺部領(lǐng)導(dǎo)Robert Puskaric說：“愛立信非常清楚他的義務(wù)：為快速發(fā)展的手機(jī)市場設(shè)計并提供靈活的創(chuàng)新的手機(jī)平臺滿足用戶的要求。我們很高興這次能與TI一起合作結(jié)合兩家公司最核心的無線技術(shù)——EMP的訪問技術(shù)和TI的創(chuàng)新的OMAP應(yīng)用處理器為當(dāng)前市場提供大容量的Open OS平臺?！? 基于這些解決方案之上的手機(jī)有望在2008年后半年投入市場。 original text [COLOR=#708090]ERICSSON AND TEXAS INSTRUMENTS TO CO-DEVELOP INNOVATIVE 3G SOLUTIONS FOR HANDSET MANUFACTURERS DALLAS （July 23, 2007） —— Ericsson （NASDAQ:ERIC）, the world‘s leading telecom supplier, and Texas Instruments Incorporated （TI） （NYSE:TXN）, the global leader in silicon solutions for wireless communications, today announced that the companies will form a strategic technology engagement to develop custom solutions for new Open OS enabled 3G devices. Solutions from the technology created by the two companies will combine small and power efficient 3G modems from Ericsson Mobile Platforms with high-performance OMAPTM applications processors from TI. Solutions from the joint engagement will include OMAP, custom basebands and connectivity technologies and will be capable of supporting the major Open OS, which offer easy access to a rich array of applications and services. The result of this joint effort will enable all device manufacturers to offer advanced Open OS handsets for both the high-end and the rapidly growing mid-range market. The collaboration between Ericsson and TI will enable handset manufacturers to deliver the exciting mobile entertainment and multimedia experiences that consumers around the world are increasingly demanding. Ericsson‘s access technology leadership, current HSPA-enabled platforms, and future HSPA evolution and LTE technologies, combined with the cutting-edge multimedia performance enabled by TI‘s OMAP 2, OMAP 3 and future generations of OMAP processors, will continue to push the performance boundaries of mobile devices and mobile entertainment features. By leveraging TI‘s OMAP platform with Open OS support for Windows® Mobile, Symbian S60, Symbian UIQ and Linux®, these solutions will provide OEMs and operators with a robust and flexible architecture for applications and services deployment, enabling easier delivery and management of services and content. This enables handset manufacturers and mobile operators to differentiate their products through rich, easy-to-use and customizable user interfaces, and through a robust and flexible application architecture. The result of the joint effort will bring to market an evolving portfolio of wireless technology platforms with Open OS support to reduce complexity, investment and time-to-market for device manufacturers. The solutions, which seamlessly integrate the modem and applications processor, will be presented in one pre-verified and tested platform reference design. This approach will drastically reduce development and verification efforts previously undertaken by device manufacturers, enabling customers to rapidly bring highly advanced yet competitively priced products to market. The joint solutions will also benefit from the Ericsson Mobile Platforms IOT program, one of the industry‘s most extensive interoperability testing processes, guaranteeing full compliance with operator requirements, speeding up time to market and securing an easy roll-out of products. Greg Delagi, senior vice president of TI‘s Wireless Terminals Business Unit, says: "It‘s a tribute to the long-standing collaborative relationship between EMP and TI that we can tap into and combine each company‘s unique wireless expertise in order to deliver the most timely, targeted solutions to the market. TI‘s broad, proven product portfolio and advanced manufacturing capabilities have continued to adjust to the demanding requirements of EMP‘s customer base. We believe that today‘s announcement will build on what TI can bring to EMP and what both companies together can bring to this vital, dynamic industry." Robert Puskaric, head of Ericsson‘s mobile platforms‘ unit, says: "Ericsson is clear in its commitment to design and offer a portfolio of flexible, innovative mobile platforms that address the requirements of the rapidly evolving mobile device market. We are pleased to work closely with TI to combine the finest of each company‘s core wireless know-how - EMP‘s access technology and platform size leadership with TI‘s innovative OMAP application processors in order to provide the most capable Open OS platforms on the market today." Handsets based on these solutions are expected to be available on the market in the second half of 2008.[/COLOR]